Plasma Cutting with HiFocus

When using the HiFocus technology for plasma cutting, a swirl gas is added which rotates around the plasma beam at very high speed and constricts the plasma beam heavily. Originally, this method comes from underwater plasma cutting and has been adopted for dry plasma cutting, too, because of its positive features: The rotation of the swirl gas has the effect that the plasma beam is strongly focussed, stabilised and protected. A big advantage for users is that this technology allows nearly rectangular cut surfaces within a broad range of material thicknesses. Further, the HiFocus plasma cutting systems are characterised by excellent cutting results when cutting thin sheets. In connection with the latest inverter technology the HiFocus technology allows highest cutting quality when cutting thin sheets and is therefore a serious competition for laser cutting.