Dry Plasma Cutting

Dry plasma cutting is often referred to as conventional or standard plasma cutting. However, the historic development should be regarded in a more differentiated way. Conventional plasma cutting means that the arc is only focussed by the inner diameter of the nozzle (see video clip).

This method could be developed further by Kjellberg Finsterwalde and Manfred von Ardenne. The fine focus plasma cutting was created which was patented in 1965 - it is known as the FineFocus technology. Due to the additional constriction of the plasma arc by means of a secondary medium (for example gas) the angular deviation could be improved substantially compared to conventional plasma cutting. Inclined cut surfaces which are typical for that process were a thing of the past.

Kjellberg Finsterwalde works continuously towards improving this process. In 2000, the HiFocus technology was an important cornerstone. In the industry today, HiFocus plasma cutting is a synonym for highest cutting quality and best perpendicularity.  Furthermore, the strong constriction of the arc allows very fine cutting of thin plates with a very small current.